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Novel manufacturing technique of recycling monocrystal silicon cutting waste mortar
The invention discloses a novel manufacturing technique of recycling the monocrystal silicon cutting waste mortar. In the process of recycling the silicon wafer cutting liquid in the waste mortar, silicon carbide micromist and solid monocrystal silicon in the waste mortar are recycled at the same ti...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
04.01.2017
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a novel manufacturing technique of recycling the monocrystal silicon cutting waste mortar. In the process of recycling the silicon wafer cutting liquid in the waste mortar, silicon carbide micromist and solid monocrystal silicon in the waste mortar are recycled at the same time, and the recovery rate is high. The recycled silicon wafer cutting liquid has the same surface activity, suspension force and carrying force as the new cutting liquid. The process of the manufacturing technique is simple and convenient in operation, short in constructing and operating costs and easy in management, capable of recycling effectively the monocrystal silicon cutting waste mortar.
本发明公开了种新型单晶硅切割废砂浆再利用生产工艺,在回收废砂浆中硅片切割液的同时,也对其中的碳化硅微粉和单晶硅固体进行了回收利用,回收率高。回收的硅片切割液具有与新切割液相同的表面活性、悬浮力和携带力,该生产工艺流程简便,建设运行成本较低,管理简单,能有效回收处理单晶硅切割废砂浆。 |
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Bibliography: | Application Number: CN20161676921 |