Polyphenyl ether modified phenol-benzaldehyde multifunctional epoxy resin and application

• Main Authors: WU CHEN HUA, JAOU SHAIN YU, LEE C.C, HWANG YEONG TONG
• Format: Patent
• Language: Chinese; English
• Published: 04.01.2017
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

The invention relates to polyphenyl ether modified phenol-benzaldehyde multifunctional epoxy resin and application thereof. The polyphenyl ether modified phenol-benzaldehyde multifunctional epoxy resin has the formula (I) shown in the specification. A preparation method of the polyphenyl ether modified phenol-benzaldehyde multifunctional epoxy resin includes the following steps that 100 parts of polyphenyl ether resin is dissolved in a solvent, 100-450 parts of phenol-benzaldehyde multifunctional epoxy resin and 0.01-5 parts of catalyst are added, a stirring reaction is carried out for 1-4 hours at the temperature of 90-180 DEG C, a solvent is added for adjusting solid type parts, and the polyphenyl ether modified phenol-benzaldehyde multifunctional epoxy resin solution is obtained. The resin is added into a glass fiber laminated plate formula composition, excellent electrical performance and heat resistance are achieved, the dielectric constant Dk is 4.03 (1GHz), the loss factor Df is 0.0046 (1GHz), and afte