Water-free eddy current grinding method and water-free eddy current grinding device

• Main Author: YANG YIZHOU
• Format: Patent
• Language: Chinese; English
• Published: 04.01.2017
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention relates to a water-free eddy current grinding method and a water-free eddy current grinding device. The method includes that a specific quantity of materials to be ground and hardware or plastic products to be treated are put into an eddy current machine in a mixed manner; a rotating disk at the inner bottom of the eddy current machine rotates, and the materials to be ground and the hardware or plastic products produce friction in the eddy current machine by centrifugal force so as to grind; a dust removing device sucks dust generated by grinding to filter the dust and air, the filtered air is discharged and the dust is collected; two air inlet pipes forming convection are arranged on a seal cover plate at the top of the eddy current machine, and strong inlet air can decrease high temperature caused by friction between the materials to be ground and the hardware or plastic products in the eddy current machine so as to achieve a cooling effect. 本发明涉及种无水涡流研磨方法及其装置，其方法为将预定份量的研磨材料与待处理的五金或塑料产品混合放入涡流机