Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method

• Main Authors: DUSA MIRCEA, DE KRUIJF NIEK ELOUT, LEENDERS MARTINUS HENDRIKUS ANTONIUS, HOUBEN MARTIJN
• Format: Patent
• Language: Chinese; English
• Published: 21.12.2016
• Subjects: ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; ELECTRONIC TIME-PIECES; HOROLOGY; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION; RADIO-CONTROLLED TIME-PIECES

A substrate support (1), includes: a substrate support location (4) configured to support a substrate (W), and a vacuum clamping device (7) configured to clamp the substrate on the substrate support location, wherein the vacuum clamping device includes at least one reduced pressure source (8) to create a reduced pressure, at least one vacuum section (9) connected to the at least one reduced pressure source, wherein the at least one vacuum section is configured to attract the substrate towards the substrate support location, and a control device (16) configured to control a spatial pressure profile along the at least one vacuum section with which the substrate is attracted by the vacuum clamping device, wherein the control device includes a substrate shape data input (16a) to receive substrate shape data representing shape data of the substrate to be clamped, and wherein the control device is configured to adapt the spatial pressure profile in dependency of the substrate shape data. 本发明反复执行下述系列处理：从事先规定的频道范围的接收