HEAT RESISTANT RESIN COMPOSITIONS, ARTICLES AND METHOD

Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unigue heat stability and special utility as insulation for electric conductors to be used in the 200-250 DEG C temperature range.

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Bibliographic Details
Main Authors JEFFREY DAVID SHEAFFER, MARK MARKOVITZ
Format Patent
LanguageEnglish
Published 08.07.1992
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
DYNAMO-ELECTRIC MACHINES
ELECTRICITY
GENERATION
INSULATORS
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unigue heat stability and special utility as insulation for electric conductors to be used in the 200-250 DEG C temperature range.
Bibliography:Application Number: CN19911007994