LED (Light-emitting Diode) packaging silica gel with high refractive index, low permeability and low water absorption

• Main Authors: CHEN WEI, ZHUANG HENGDONG
• Format: Patent
• Language: Chinese; English
• Published: 16.11.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The invention relates to an LED (Light-emitting Diode) packaging silica gel with a high refractive index, which comprises a component A and a component B. The weight ratio of the component A to the component B is 4:1; the component A is prepared from the following raw materials in parts by weight: 80 to 90 parts of methyl-phenyl vinyl silicon resin, 8 to 18 parts of organosilicone containing a cycloolefin structure, 0.1 to 0.3 part of platinum-based catalyst, and 1 to 5 parts of adhesive; the component B is prepared from the following raw materials in parts by weight: 30 to 50 parts of organosilicone containing the cycloolefin structure, 50 to 70 parts of diphenyl polysiloxane containing hydrogen on a chain extender end, and 0.1 to 0.3 part of inhibitor. In a molecular structure design of a formula, a molecular structure with a main chain containing a benzene ring and an end group containing a cycloolefin functional group is introduced, so that not only are an excellent optical structure and a high refractive