Circuit board and film pasting method thereof

• Main Authors: YANG ZHIWANG, LIU WEN, SHU JIANPING, WANG MING
• Format: Patent
• Language: Chinese; English
• Published: 09.11.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a circuit board and a film pasting method thereof. The method comprises: film pasting is carried out along a direction parallel to a circuit board step site; and wet-method film pasting is carried out during the film pasting process. And a rolling temperature is controlled to be 80 DEG C to 100 DEG C; the pressure is controlled to be 5+/-1 kg/cm ; the film pasting speed is controlled to be 0.8 to 1.5 m/min. According to the invention, on the basis of pasting way adjustment, a phenomenon that a dried film can not be pasted at a step site tightly can be prevented; problems of line open-circuit existence and poor corrosion of the step site can be solved; the product yield is improved; the manufacturing cost is lowered; and the production efficiency is improved. 本发明公开种线路板及其贴膜方法，其中，贴膜方法包括步骤：按照与线路板台阶位平行的方向进行贴膜，且贴膜过程采用湿法贴膜，压辘温度控制在：80~100℃，压力控制在：5±1kg/cm，贴膜速度控制在：0.8~1.5m/min。本发明通过对贴合方式的调整，最终改善了台阶位产品贴干膜压不实现象，解决了台阶位线路开路，溶蚀不良等问题，提高了产品良率，降低了制作成本，提高了生产效率。