Light-emitting diode (LED) package

• Main Authors: LEE HAOUNG, LIN YU-FENG
• Format: Patent
• Language: Chinese; English
• Published: 26.10.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A light-emitting diode (LED) package including a rectangular carrier, an LED chip, and an encapsulant is provided. The rectangular carrier has an upper surface. The LED chip is mounted on the upper surface and is electrically connected to the rectangular carrier. The encapsulant has a curved convex surface and covers the entire upper surface and the LED chip. The encapsulant is doped with a phosphor material for converting at least parts of light emitted from the LED chip. The encapsulant doped with the phosphor material is visually neon orange when the LED chip does not emit the light. In this way, the joint area between the encapsulant and the carrier can be increased, and the reliability of components of the LED can be improved. 本发明提供种发光二极管封装，其包括矩形承载器、发光二极管芯片以及封装胶体。矩形承载器具有承载表面。发光二极管芯片配置于承载表面上并且与承载器电性连接。封装胶体覆盖承载表面及发光二极管芯片，封装胶体中掺杂有荧光材料，用以转换至少部分发光二极管所发出的光线，封装胶体具有弧形凸面并覆盖整个承载表面。在发光二极管芯片无发光的情况下，掺杂有荧光材料的封装胶体在视觉上呈荧光橘色。从而可增进封装胶体与承载器之间的接合面积，使得发光二极管封装的元件信赖性获得提升。