Pumping system and method for lowering the pressure in a load-lock chamber

The invention concerns a pumping system intended to be connected to a load-lock chamber (2) for loading and unloading a substrate (5), comprising at least a first primary pumping unit (9a, 9b) having a first maximum pumping speed (S1) and a second primary pumping unit (10a, 10b) having a second maxi...

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Bibliographic Details
Main Author BECOURT NICOLAS
Format Patent
LanguageChinese
English
Published 28.09.2016
Subjects
BLASTING
HEATING
LIGHTING
MECHANICAL ENGINEERING
POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS
PUMPS
PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENTMACHINES FOR LIQUIDS
ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENTPUMPS
WEAPONS
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Summary:The invention concerns a pumping system intended to be connected to a load-lock chamber (2) for loading and unloading a substrate (5), comprising at least a first primary pumping unit (9a, 9b) having a first maximum pumping speed (S1) and a second primary pumping unit (10a, 10b) having a second maximum pumping speed (S2), each primary pumping unit (9a, 9b, 10a, 10b) comprising a single-stage Roots vacuum pump (15) and a primary vacuum pump (13), the single-stage Roots vacuum pump (15) being mounted in series with and upstream from the primary vacuum pump (13) in the direction of flow of the gases to be pumped, said first and second primary pumping units (9a, 9b, 10a, 10b) being mounted in parallel and configured to simultaneously pump the load-lock chamber (2) for loading and unloading the substrate, characterised in that said first primary pumping unit (9a, 9b) has different pumping characteristics to said second primary pumping unit (10a, 10b), the difference between the first and second maximum pumping spe
Bibliography:Application Number: CN201580008126