Hot melt pressure sensitive adhesive and thermoset comprising styrene-butadiene polymers having high vinyl and high di-block

The present invention provides methods and systems for a hot melt pressure sensitive adhesive and thermoset that comprises from about 5 to about 50 wt.% of a block copolymer, from about 0 to about 75 wt.% of a tackifying resin, from about 0 to about 45 wt.% of an oil, and from about 0 to about 3 wt....

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Bibliographic Details
Main Author GILLEN JASON
Format Patent
LanguageChinese
English
Published 28.09.2016
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention provides methods and systems for a hot melt pressure sensitive adhesive and thermoset that comprises from about 5 to about 50 wt.% of a block copolymer, from about 0 to about 75 wt.% of a tackifying resin, from about 0 to about 45 wt.% of an oil, and from about 0 to about 3 wt.% of an antioxidant. 本发明提供用于热熔压敏粘合剂和热固性树脂的方法与体系，它包括约5至约50wt％嵌段共聚物，约0至约75wt％增粘树脂，约0至约45wt％油，和约0至约3wt％抗氧化剂。
Bibliography:Application Number: CN201480074186