Multilayer soft plate manufacturing method capable of avoiding interlayer dislocation and multilayer soft plate

• Main Authors: Wang Ming, Li Taiwei, Yang Yixiang, Hua Bing, Liu Wen, Shu Jianping, Yang Zhiwang
• Format: Patent
• Language: Chinese; English
• Published: 31.08.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a multilayer soft plate manufacturing method capable of avoiding interlayer dislocation and a multilayer soft plate. The method comprises the steps of: A, firstly carrying out back glue processing on soft plates; B, superposing a plurality of soft plates in sequence, wherein in the superposing process, a back glue surface of one soft plate is superposed with a non-back-glue surface of another soft plate, the back glue surface is arranged on the upper layer and the non-back-glue surface is arranged on the lower layer; C, placing the plurality of superposed soft plates in a area to be pressed and carrying out pressing processing; and D, carrying out solidification on the plurality of pressed soft plates. According to the invention, the problem of interlayer dislocation caused in the pressing process of a common rapid pressing machine is effectively improved, the non-compaction phenomenon is simultaneously avoided, and guarantee is provided for using the common rapid pressing machine to p