A structure for a heat transfer interface and method of manufacturing the same

• Main Authors: ROBINSON ANTHONY, KEMPERS ROGER SCOTT, AHERN PAUL, LYONS ALAN MICHAEL
• Format: Patent
• Language: Chinese; English
• Published: 17.08.2016
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEATING; LIGHTING; MECHANICAL ENGINEERING; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL; PERFORMING OPERATIONS; PUNCHING METAL; SEMICONDUCTOR DEVICES; TRANSPORTING; WEAPONS; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL

A heat transfer interface structure and a method of manufacturing the same are disclosed. A substrate has a plurality of raised features formed on at least one surface of the substrate. The raised features are deformable under a compressive force and have respective openings at end portions thereof. A thickness of a raised feature at the end portion thereof is smaller than a thickness of the raised feature at an intermediate portion of the raised feature. 本发明揭示种热传递界面结构以及其制造方法。衬底具有在所述衬底的至少个表面上形成的多个凸起特征。所述凸起特征在压缩力下可变形并且在其末端部分具有对应开口。凸起特征在其所述末端部分的厚度小于所述凸起特征在所述凸起特征的中间部分的厚度。