Negative-type photosensitive resin composition, photocuring pattern formed by using the same and image display device

The present invention relates to a negative-type photosensitive resin composition cured at a low temperature, and having excellent adhesion with a substrate and chemical resistance, a photocuring pattern formed by using the same and an image display device comprising the pattern. 本发明涉及可以低温固化、对于基板的密合...

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Bibliographic Details
Main Authors YANG, Don-Sik, CHUN, Ji-Min, KIM, Seong-Been
Format Patent
LanguageChinese
English
Published 17.08.2016
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:The present invention relates to a negative-type photosensitive resin composition cured at a low temperature, and having excellent adhesion with a substrate and chemical resistance, a photocuring pattern formed by using the same and an image display device comprising the pattern. 本发明涉及可以低温固化、对于基板的密合性、耐化学性优异的负型感光性树脂组合物、使用其形成的光固化图案和包含所述图案的图像显示装置。
Bibliography:Application Number: CN201610084773