Surface-treated copper foil, copper foil with carrier, printed wiring board, copper-clad laminate, laminate and method for producing printed wiring board

• Main Authors: SASAKI SHINICHI, MIYAMOTO NOBUAKI, ISHII MASAFUMI
• Format: Patent
• Language: Chinese; English
• Published: 10.08.2016
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

Provided is a surface-treated copper foil having excellent fine wiring formability. This surface-treated copper foil is obtained by forming a surface treatment layer on a copper foil. In cases where this surface-treated copper foil is spray etched from a surface that is on the reverse side of the surface on which the surface treatment layer is formed using a hydrogen peroxide/sulfuric acid-based copper dissolving etchant, if the etching rate in the thickness direction of the copper foil is taken as 1, the etching rate in the thickness direction of the surface treatment layer is 0.5 or more. 提供种微细配线形成性优异的表面处理铜箔。表面处理铜箔，在铜箔上形成有表面处理层，当从与形成有表面处理层的表面为相反侧的表面以过氧化氢/硫酸系的铜溶解蚀刻液进行喷雾蚀刻时，在使铜箔的厚度方向的蚀刻速率为1的情形时，表面处理层的厚度方向的蚀刻速率在0.5以上。