Device and method for positioning a photolithography mask by means of a contactless optical method
The present invention relates to a device for positioning a mask (10) in relation to the surface of a wafer (11), with a view to exposing said wafer to light (11). Said device includes: (i) first positioning means (20) capable of holding and moving said mask (10) and said wafer (11), relative to one...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
03.08.2016
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a device for positioning a mask (10) in relation to the surface of a wafer (11), with a view to exposing said wafer to light (11). Said device includes: (i) first positioning means (20) capable of holding and moving said mask (10) and said wafer (11), relative to one another; (ii) imaging means (20, 22, 23, 30) capable of producing at least one image of the mask (10) and of the surface of the wafer (11) along at least one visual field (14), such as to simultaneously image, within said visual field (14), reference points (12, 13) for positioning said mask (10) and said wafer (11); and (iii) at least one optical distance sensor (26) capable of producing a distance measurement between the surface of the wafer (11) and the mask (10), within said visual field(s) (14), using a measurement beam (15, 28) that passes at least partially through the imaging means. The invention also relates to a method, implemented in said device, and to an apparatus.
本发明涉及用于相对于晶片(11)的表面定位掩模(10)以暴露所述晶片(1 |
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Bibliography: | Application Number: CN201480066168 |