Polyamide And Its Use In A Release Lacquer

• Main Authors: Boccon Nadege, Tonnoir Olivier, Brettar Julie
• Format: Patent
• Language: Chinese; English
• Published: 03.08.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

The present invention is related to a polyamide resin, consisting of a main structural unit consisting of monomers selected from the group consisting of (i)at least one dimeric C10-30 carboxylic acid and (ii) at least one polyamine, preferably selected from the group consisting of diamines and triamines, and at least one polyorganosiloxane moiety covalently linked to said at least one main structural unit, and optionally at least one chain-terminating agent covalently linked to said main structural unit. The present invention is furthermore related to a process for preparing said polyamide resin, to a release lacquer comprising said polyamide resin, and to a film, comprising said release lacquer on its one surface and a layer of a pressure-sensitive adhesive on its other surface. 本发明涉及聚酰胺树脂，其由主要结构单元，和共价连接到所述至少个主要结构单元的至少个聚有机硅氧烷部分，和任选地，共价连接到所述主要结构单元的至少种链终止剂组成，所述主要结构单元由选自以下的单体组成：(i)至少种二聚C10?30羧酸和(ii)至少种多胺，所述多胺优选地选自二胺和三胺。本发明还涉及将所述聚酰胺树脂制备为包含所述聚酰胺树脂的防粘漆的方法，以及制备为包含在其个表面上的所述防粘漆和在其另表面上的压敏粘合剂层的膜的方法。