Chemical nickel-phosphorus-plated alloy solution and method for applying the same to printed wiring board to deposit nickel-phosphorus alloy

• Main Authors: Zhang Jie, Xiao Wenquan, Bai Kunsheng
• Format: Patent
• Language: Chinese; English
• Published: 03.08.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention relates to the technical field of printed wiring board chemical nickel-phosphorus-plated alloys, particularly to a chemical nickel-phosphorus-plated alloy solution and a method for applying the same to a printed wiring board to deposit a nickel-phosphorus alloy. The chemical nickel-phosphorus-plated alloy solution includes organic disulphides and polysulfides and inorganic polysulfides, and specifically contains but is not limited alkyl disulphides and derivatives thereof, thiuram and derivatives thereof, thiazole and derivatives thereof, and thiourea and derivatives thereof. The content of a sulfide accelerator in a chemical nickel plating solution is 0.05 to 50 ppm, can satisfy an actual production nickel depositing rate requirement, can prevent the nickel-phosphorus alloy deposited on a copper-based circuit from diffusion plating or skip plating, and can still keep nickel-phosphorus alloy deposition activity after aging of a bath solution. 本发明涉及印制线路板化学镀镍磷合金技术领域，特指化学镀镍磷合金溶液及其应用在印制线路板上沉积镍磷合金的方法