Method for manufacturing substrate holder
The invention discloses a method for manufacturing a substrate holder. A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. Th...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
03.08.2016
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a method for manufacturing a substrate holder. A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The thin film stack comprises an (optional) isolation layer, a metal layer forming an electrode, a sensor, a heater, a transistor or a logic device, and a top isolation layer. The method comprises steps: arranging the planarization layer on at least one part of the surface of a main body of the substrate holder, and forming or attaching the thin film stack on or to the top of the planarization layer. The thin film stack forms an electric or electrical component. A plurality of burls project from the surface and have end surfaces to support a substrate. The thin film stack is separated from the adjacent burls of the plurality of burls by gaps.
本发明公开了制造衬底保持器的方法。用于光刻设备的衬底保持器具有设置在其表面上的平坦化层。该平坦化层提供平滑表面,用于形成薄膜叠层以形成电子部件。该薄膜 |
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Bibliography: | Application Number: CN20161252175 |