Packaged LED and manufacturing method thereof

• Main Authors: ZOU QIBING, QI YANGYANG, LUO XINFANG
• Format: Patent
• Language: Chinese; English
• Published: 06.07.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a packaged LED and a manufacturing method thereof. The packaged LED comprises a base, a reflecting cup, an LED chip, a plurality of conductive electrodes and insulated bosses, wherein the conductive electrodes are arranged on the base; the reflecting cup is arranged on the conductive electrodes; the LED chip is arranged in the reflecting cup; the conductive electrodes are used for being electrically connected with a positive electrode or a negative electrode of the LED chip; the insulated bosses are arranged on the base and are located in the reflecting cup; and the bosses are arranged in gaps between adjacent conductive electrodes. According to the packaged LED, the silver migration distances among the conductive electrodes can be effectively increased through the bosses; short circuits among the conductive electrodes are reduced; and the service lifetime of the packaged LED is prolonged. Particularly, improvement of the manufacturing first-pass yield and reduction of the out-of-contr