Manufacturing method for flip LED chip

The invention discloses a manufacturing method for a flip LED chip. A funnel-shaped protection layer is arranged around an ITO layer, a reflective layer and a barrier layer based on different etching selection ratios and a creative deposition manner, wherein the funnel-shaped opening of the protecti...

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Bibliographic Details
Main Authors ZHANG XIAOFEI, SHAO XIAOJUAN, YANG BILAN, ZHU LIQIN, LIN QUAN
Format Patent
LanguageChinese
English
Published 22.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention discloses a manufacturing method for a flip LED chip. A funnel-shaped protection layer is arranged around an ITO layer, a reflective layer and a barrier layer based on different etching selection ratios and a creative deposition manner, wherein the funnel-shaped opening of the protection layer has a bigger upper part and a smaller lower part. The problem of frequent electric leakage of the existing flip LED chip is solved. 本发明公开了倒装LED芯片的制作方法，通过不同蚀刻选择比及创新的沉积方式，在ITO层、反射层和阻挡层周围，环绕呈漏斗状、开口上大下小的保护层，改善习知倒装LED芯片容易发生漏电的问题。
Bibliography:Application Number: CN20161220840