Heat-transfer structure

The invention provides a heat-transfer structure. An apparatus 100 comprising a first substrate 130 having a first surface 125, a second substrate 132 having a second surface 127 facing the first surface and an array 170 of metallic raised features 170 being located on the first surface, each raised...

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Bibliographic Details
Main Authors KRISHNAN SHANKAR, KEMPERS ROGER SCOTT, SALAMON TODD RICHARD, LYONS ALAN MICHAEL
Format Patent
LanguageChinese
English
Published 22.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL
PERFORMING OPERATIONS
PUNCHING METAL
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Summary:The invention provides a heat-transfer structure. An apparatus 100 comprising a first substrate 130 having a first surface 125, a second substrate 132 having a second surface 127 facing the first surface and an array 170 of metallic raised features 170 being located on the first surface, each raised feature being in contact with the first surface to the second surface, a portion of the raised features being deformed via a compressive force 305. 本申请关于种热传递结构。装置100包括具有第表面125的第基底130、具有面向所述第表面的第二表面127的第二基底132、以及位于所述第表面上的金属凸起特征170的阵列170，每个凸起特征将所述第表面与所述第二表面相接触，所述凸起特征的部分经由压缩力305而变形。
Bibliography:Application Number: CN201610084865