COB (chip on board) light source packaging structure for LED and manufacture method of COB light source packaging structure

• Main Author: YANG RENYI
• Format: Patent
• Language: Chinese; English
• Published: 08.06.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a COB (chip on board) light source packaging structure which can greatly reduce the junction temperature of an LED chip, prolong the service life of a COB light source and guarantee the amount of outgoing light of the chip and is applied to an LED. The COB light source packaging structure for the LED comprises flip chips, a conductive copper layer, an insulation layer and an aluminum substrate which are arranged sequentially from top to bottom, wherein the flip chips are arranged in an array manner, electrodes of each flip chip are connected with the conductive copper layer through a welding material, a hole is formed under each flip chip and filled with a high thermally conductive insulating material with the thermal conductivity higher than or equal to 0.2 W/(m*K), and a high thermally conductive insulating part is formed. The invention further provides a manufacture method of the COB light source packaging structure for the LED. 本发明公开种LED？COB光源封装结构,其能够大大降低LED芯片的结温，使得COB光源的使用寿命增加，芯片出