Semiconductor grinding agent
The invention provides a semiconductor grinding agent. The semiconductor grinding agent comprises alumina and an aqueous medium and further comprises 10 to 15 parts of sodium tripolyphosphate, 1 to 5 parts of diamond particles, 5 to 10 parts of sodium hexametaphosphate and 1 to 5 parts of a dispersa...
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Format | Patent |
Language | Chinese English |
Published |
01.06.2016
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Subjects | |
Online Access | Get full text |
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Abstract | The invention provides a semiconductor grinding agent. The semiconductor grinding agent comprises alumina and an aqueous medium and further comprises 10 to 15 parts of sodium tripolyphosphate, 1 to 5 parts of diamond particles, 5 to 10 parts of sodium hexametaphosphate and 1 to 5 parts of a dispersant. Compared with the prior art, the grinding agent provided by the invention has the beneficial effect of good performance through addition of tripolyphosphate, diamond particles, sodium hexametaphosphate and the dispersant. |
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AbstractList | The invention provides a semiconductor grinding agent. The semiconductor grinding agent comprises alumina and an aqueous medium and further comprises 10 to 15 parts of sodium tripolyphosphate, 1 to 5 parts of diamond particles, 5 to 10 parts of sodium hexametaphosphate and 1 to 5 parts of a dispersant. Compared with the prior art, the grinding agent provided by the invention has the beneficial effect of good performance through addition of tripolyphosphate, diamond particles, sodium hexametaphosphate and the dispersant. |
Author | YANG BOWEI |
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RelatedCompanies | SHENYANG XINDA INFORMATION TECHNOLOGY CO., LTD |
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Snippet | The invention provides a semiconductor grinding agent. The semiconductor grinding agent comprises alumina and an aqueous medium and further comprises 10 to 15... |
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Title | Semiconductor grinding agent |
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