Semiconductor grinding agent

The invention provides a semiconductor grinding agent. The semiconductor grinding agent comprises alumina and an aqueous medium and further comprises 10 to 15 parts of sodium tripolyphosphate, 1 to 5 parts of diamond particles, 5 to 10 parts of sodium hexametaphosphate and 1 to 5 parts of a dispersa...

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Bibliographic Details
Main Author YANG BOWEI
Format Patent
LanguageChinese
English
Published 01.06.2016
Subjects
ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
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Summary:The invention provides a semiconductor grinding agent. The semiconductor grinding agent comprises alumina and an aqueous medium and further comprises 10 to 15 parts of sodium tripolyphosphate, 1 to 5 parts of diamond particles, 5 to 10 parts of sodium hexametaphosphate and 1 to 5 parts of a dispersant. Compared with the prior art, the grinding agent provided by the invention has the beneficial effect of good performance through addition of tripolyphosphate, diamond particles, sodium hexametaphosphate and the dispersant.
Bibliography:Application Number: CN20141622234