Low-temperature-resistant packaging material and preparation method therefor

• Main Author: SUN ZHENGLIANG
• Format: Patent
• Language: Chinese; English
• Published: 01.06.2016
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention discloses a low-temperature-resistant packaging material. The packaging material contains the following raw materials in parts by weight: 15-30 parts of polyimide, 10-15 parts of polytetrafluoroethylene, 10-15 parts of polytrifluorochloroethylene, 5-10 parts of butyronitrile, 2-5 parts...