Low-temperature-resistant packaging material and preparation method therefor

The invention discloses a low-temperature-resistant packaging material. The packaging material contains the following raw materials in parts by weight: 15-30 parts of polyimide, 10-15 parts of polytetrafluoroethylene, 10-15 parts of polytrifluorochloroethylene, 5-10 parts of butyronitrile, 2-5 parts...

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Bibliographic Details
Main Author SUN ZHENGLIANG
Format Patent
LanguageChinese
English
Published 01.06.2016
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:The invention discloses a low-temperature-resistant packaging material. The packaging material contains the following raw materials in parts by weight: 15-30 parts of polyimide, 10-15 parts of polytetrafluoroethylene, 10-15 parts of polytrifluorochloroethylene, 5-10 parts of butyronitrile, 2-5 parts of polysulfone, 2-5 parts of silicon rubber, 5-10 parts of methylphenylvinyl silicone, 10-20 parts of organic silicone gel, 5-15 parts of asbestos, 5-10 parts of polyester, 5-10 parts of epoxy resin, 5-15 parts of polycarbonate, 5-10 parts of cycloheptene, 2-5 parts of aziridine, 5-10 parts of an emulsifier and 5-10 parts of an accelerant. Meanwhile, the invention discloses a preparation method for the low-temperature-resistant packaging material.
Bibliography:Application Number: CN20161167702