Preparation method of high-heat-conductivity polymer-base heat dissipation material

• Main Authors: PEI JUN, WANG ZHIHUI, LIN DAWEI
• Format: Patent
• Language: Chinese; English
• Published: 25.05.2016
• Subjects: APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBONFILAMENTS; CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS,THREADS, FIBRES, BRISTLES OR RIBBONS; CHEMISTRY; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; METALLURGY; NATURAL OR ARTIFICIAL THREADS OR FIBRES; ORGANIC MACROMOLECULAR COMPOUNDS; SPINNING; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; TEXTILES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention discloses a preparation method of a high-heat-conductivity polymer-base heat dissipation material, belonging to the field of heat dissipation materials. By using an epoxy resin as a matrix and boron-containing silicon nitride as a filler, a coupling agent is added so that the filler has physical entanglement and chemical crosslinking among the epoxy resin, thereby finally obtaining the high-heat-conductivity polymer-base heat dissipation material. The prepared boron-containing silicon nitride filler has very high heat conductivity coefficient and huge specific area, and can have favorable dispersity and favorable interface compatibility in the epoxy resin. The prepared heat dissipation material has excellent dielectric properties, heat-conducting property and heat stability.