A scribing head device for a bonded substrate

The invention provides a scribing head device for a bonded substrate, which can guarantee high scribing quality even substrates forming the bonded substrate differ in thickness. A non-contact-type air bearing part 30 for spraying air to the surface of the bonded substrate 3 is attached to at least o...

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Bibliographic Details
Main Author JU, WON YONG
Format Patent
LanguageChinese
English
Published 25.05.2016
Subjects
CHEMISTRY
GLASS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METALLURGY
MINERAL OR SLAG WOOL
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Summary:The invention provides a scribing head device for a bonded substrate, which can guarantee high scribing quality even substrates forming the bonded substrate differ in thickness. A non-contact-type air bearing part 30 for spraying air to the surface of the bonded substrate 3 is attached to at least one of a pair of scribing heads arranged opposite the upper and lower surfaces of the bonded substrate 3, so that the force balance can be maintained even the load of the upper scribing head is different from the load of the lower scribing head because of the thicknesses of the substrates and the same breaking precision can be obtained on the two surfaces of the bonded substrate.
Bibliography:Application Number: CN201510657283