Wiring member, method of manufacturing the same, method of designing the same, and electronic apparatus
The invention provides a wiring member, a method of manufacturing the same, a method of designing the same, and an electronic apparatus. There is provided a wiring member including: a wiring substrate including wirings including a ground line, and a first insulating layer that covers the wirings and...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
18.05.2016
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a wiring member, a method of manufacturing the same, a method of designing the same, and an electronic apparatus. There is provided a wiring member including: a wiring substrate including wirings including a ground line, and a first insulating layer that covers the wirings and has an opening portion exposing at least a portion of the ground line; a conductive sheet sandwiched between a second insulating layer and a conductive bonding layer and disposed on the first insulating layer in a state where the conductive sheet is folded so that the second insulating layers faces to each other, and in which the conductive bonding layer in a portion which is not folded is electrically connected to the ground line through the opening portion; and a shielding member disposed on the wiring substrate and the conductive sheet to be bonded to the conductive bonding layer in a portion of the conductive sheet which is folded, and is electrically connected to the ground line through the folded portion. |
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Bibliography: | Application Number: CN201510746707 |