Wiring member, method of manufacturing the same, method of designing the same, and electronic apparatus

The invention provides a wiring member, a method of manufacturing the same, a method of designing the same, and an electronic apparatus. There is provided a wiring member including: a wiring substrate including wirings including a ground line, and a first insulating layer that covers the wirings and...

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Bibliographic Details
Main Authors ICHIRO TOMIKAWA, YASUMASA ASAYA
Format Patent
LanguageChinese
English
Published 18.05.2016
Subjects
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Summary:The invention provides a wiring member, a method of manufacturing the same, a method of designing the same, and an electronic apparatus. There is provided a wiring member including: a wiring substrate including wirings including a ground line, and a first insulating layer that covers the wirings and has an opening portion exposing at least a portion of the ground line; a conductive sheet sandwiched between a second insulating layer and a conductive bonding layer and disposed on the first insulating layer in a state where the conductive sheet is folded so that the second insulating layers faces to each other, and in which the conductive bonding layer in a portion which is not folded is electrically connected to the ground line through the opening portion; and a shielding member disposed on the wiring substrate and the conductive sheet to be bonded to the conductive bonding layer in a portion of the conductive sheet which is folded, and is electrically connected to the ground line through the folded portion.
Bibliography:Application Number: CN201510746707