Method of producing layer structure, layer structure, a method of forming patterns and a semiconductor device

• Main Authors: YI, SONGSE, KIM, YOUNG-MIN, YU, NAERY, JEONG, SEULGI, KIM, MIN-SOO, NAM, YOUN-HEE, KANG, SUN-HAE, YOON, BYERI, KIM, SUNG-HWAN, KIM, MYEONGKOO, LEE, CHUNG-HEON, JO, YEON-HEE, HWANG, SUN-MIN, KIM, SUNG-MIN, YOON, YONG-WOON, SONG, HYUN-JI, KIM, YUN-JUN, BAEK, JAE-YEOL, KIM, HEA-JUNG, HONG, SEUNG-HEE, HWANG, WON-JONG
• Format: Patent
• Language: Chinese; English
• Published: 11.05.2016
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The invention provides a method of producing a layer structure, the layer structure, a method of forming patterns and a semiconductor device. The method of producing the layer structure includes forming a first organic layer (S1) by applying a first composition including an organic compound on a substrate having a plurality of patterns, applying a solvent on the first organic layer to remove a part (S2) of the first organic layer, and applying a second composition including an organic compound on a remaining part of the first organic layer and forming a second organic layer (S3) through a curing process, so that the layer structure with excellent flat characteristics can be manufactured, and individual etching-back procedures or chemico-mechanical polishing procedures are not needed.