A floor panel for an aircraft, and an aircraft comprising such a floor panel

• Main Author: ECKHARD NEHRING
• Format: Patent
• Language: Chinese; English
• Published: 11.05.2016
• Subjects: AEROPLANES; AIRCRAFT; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSIONTRANSMISSIONS IN AIRCRAFT; AVIATION; BLASTING; CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS,e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USERAPPLICATIONS; COSMONAUTICS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATINGSYSTEMS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELEMENTS OR COMPONENTS THEREFOR; EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLYING SUITS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; HEATING; HELICOPTERS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; LIGHTING; MECHANICAL ENGINEERING; PARACHUTES; PERFORMING OPERATIONS; RANGES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; TRANSPORTING; VENTILATING; WEAPONS

Described and illustrated is a floor panel (1) for an aircraft, said floor panel (1) comprising a panel structure (3) for transmitting forces applied to the floor panel (1), wherein the panel structure (3) includes an upper cover layer (7), a lower cover layer (9), and a core assembly (11) sandwiched between the upper and lower cover layers (7, 9), and a heater layer (5) for heating the floor panel (1), wherein the heater layer (5) is provided between the upper and lower cover layers (7, 9). The object of the present invention, to provide a possibly simple heated floor panel for an aircraft, wherein the risk of overheating and at the same time the risk of local hot spots at the heater layer is reduced, is achieved in that the heater layer (5) is formed as a PTC-layer having a plurality of electric conductor paths (27) interconnected to one another by a plurality of PTC-resistor paths (29) comprising a PTC-material, wherein the electric resistance of said PTC-Material increases with increasing temperature.