Substrate processing device and film forming device

• Main Authors: TATEKAWA SHINSUKE, KIYOTA JUNYA, OHNO TETSUHIRO, ARAI SUSUMU, TSUKIKAWA YOSHIZUMI, TAKEI MASAKI, ISOBE TATSUNORI
• Format: Patent
• Language: Chinese; English
• Published: 04.05.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention provides a substrate processing device and a film forming device. The substrate processing device is provided with a casing (21) and a hollow swing arm (23) located inside the casing. The swing arm includes a hollow swing center shaft part (23a) connected to the casing and a hollow linking shaft part (23b) representing the swinging end. The substrate processing device is further provided with a processing part (22) located inside the casing and adapted to move within a processing space, which faces the substrate, in a direction orthogonal to the axial direction (P) of the swing center shaft part and process the substrate. The processing part is linked to the linking shaft part so that the linking shaft part (23b) is able to move parallel to the processing part so as to track the movement of the processing part. Therefore, the movement of the processing part (22) causes the swing arm (23) to swing. The substrate processing device is further provided with a connection line located inside t