Method for processing a carrier, a method for operating a plasma processing chamber, and a method for processing a semiconductor wafer

Various embodiments of the disclosure relate to a method for processing a carrier, a method for operating a plasma processing chamber, and a method for processing a semiconductor wafer. According to various embodiments, a method for processing a carrier may include: performing a dry etch process in...

Full description

Saved in:
Bibliographic Details
Main Authors BRENCHER LOTHAR, RENNER MICHAEL
Format Patent
LanguageChinese
English
Published 06.04.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Various embodiments of the disclosure relate to a method for processing a carrier, a method for operating a plasma processing chamber, and a method for processing a semiconductor wafer. According to various embodiments, a method for processing a carrier may include: performing a dry etch process in a processing chamber to remove a first material from the carrier by an etchant, the processing chamber including an exposed inner surface including aluminum and the etchant including a halogen; and, subsequently, performing a hydrogen plasma process in the processing chamber to remove a second material from at least one of the carrier or the inner surface of the processing chamber.
Bibliography:Application Number: CN201510634108