Ceramic substrate circuit board and manufacturing method thereof

• Main Authors: LI DEBING, CAO GUOPING, XIAO QINGRONG
• Format: Patent
• Language: English
• Published: 17.02.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a ceramic substrate circuit board and a manufacturing method thereof. The manufacturing method comprises the following steps: step one, embedding palladium-silver slurry in a ceramic substrate through a sintering process to form a palladium-silver pad; and step two, attaching an antioxidation material on the surface, which is away from the ceramic substrate, of the palladium-silver pad to form an antioxidation layer through an electroplating technology. The ceramic substrate circuit board and the manufacturing method thereof, provided by the invention, can effectively improve the antioxidation performance and the wear resistance of the ceramic substrate circuit board and prolong the service life of the ceramic substrate circuit board; the antioxidation layer is attached to the palladium-silver pad through the electroplating technology so that the structure of the antioxidation layer is more flat and stable, and the overall performance of the ceramic substrate circuit board can be effectively improved; and since a solder tin layer is omitted from between the antioxidation layer and the palladium-silver pad, the thickness of the ceramic substrate circuit board can be effectively reduced, and more design space is provided for electronic products manufactured by use of the circuit board.