Material sheet for ultrathin SOD123FL encapsulation diode

• Main Authors: YANG HAILIN, ZHANG FEI, GE ZHENGLIN
• Format: Patent
• Language: English
• Published: 17.02.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a material sheet for an ultrathin SOD123FL encapsulation diode. The material sheet includes an upper frame and a lower frame; the upper frame and the lower frame form a matrix type two-piece material sheet structure; the upper frame includes two upper frame longitudinal reinforcing bars arranged in parallel and a plurality of upper frame transverse reinforcing bars, wherein the plurality of upper frame transverse reinforcing bars are parallelly arranged between the two upper frame longitudinal reinforcing bars, and each upper frame transverse reinforcing bar is provided with a plurality of symmetrically-arranged upper carrying sheets, wherein the upper carrying sheet includes a GPP chip P-pole contact surface and a diode P-pole lead; and the lower frame includes two lower frame longitudinal reinforcing bars which are arranged in parallel and a plurality of lower frame transverse reinforcing bars which are the same with the upper frame transverse reinforcing bars, wherein the lower frame transverse reinforcing bars are parallelly arranged between the lower frame longitudinal reinforcing bars, and the lower frame transverse reinforcing bars are provided with lower carrying sheets which are corresponding to each upper carrying sheet, wherein the lower carrying sheet includes a GPP chip N-pole contact surface and a diode N-pole lead.