Light emitting device package

The disclosure provides a light emitting device package including a package body (210), a first lead frame (220a) and a second lead frame (220b) disposed on the package body, and a flip-chip type light emitting diode (240) electrically connected to the first lead frame and the second lead frame via...

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Bibliographic Details
Main Authors MOON KEAL-DOO, LEE DONG-YONG, OH SUNG-JOO
Format Patent
LanguageEnglish
Published 03.02.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The disclosure provides a light emitting device package including a package body (210), a first lead frame (220a) and a second lead frame (220b) disposed on the package body, and a flip-chip type light emitting diode (240) electrically connected to the first lead frame and the second lead frame via respective conductive adhesives (310, 320). The conductive adhesives may be formed of a solder or of any other conductive materials. At least one of the conductive adhesives has its smallest width (W0) at a central region thereof.
Bibliography:Application Number: CN201510289268