Semiconductor device

A semiconductor device is provided with a semiconductor substrate (12) having elements, a surface electrode (18) connected to the elements, a rear face electrode (14) connected to the elements, a protective layer (20) disposed on separation regions (28) upon the surface of the semiconductor substrat...

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Bibliographic Details
Main Authors SUGIURA SHUN, OOKURA YASUSHI, FUJII TAKESHI, IMAGAWA TETSUTARO
Format Patent
LanguageEnglish
Published 27.01.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device is provided with a semiconductor substrate (12) having elements, a surface electrode (18) connected to the elements, a rear face electrode (14) connected to the elements, a protective layer (20) disposed on separation regions (28) upon the surface of the semiconductor substrate, and a temperature sensor (22) disposed on the surface side of the semiconductor substrate. The surface electrode is divided by the protective layer in at least 2 directions into multiple surface electrodes. The separation regions include opposing regions (30) positioned between opposing sides of neighboring surface electrodes, and intersection regions (32) at which opposing regions intersect. The temperature sensor is placed at only the opposing regions.
Bibliography:Application Number: CN201480032850