Cover plate and method of fabricating the same

A method of fabricating cover plate including the following steps is provided. A plurality of concaves is formed on a mother substrate. A first strengthening treatment is performed on the concave surfaces of the concaves to form an ion strengthened layer thereon. The mother substrate is cut into a p...

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Bibliographic Details
Main Authors LIN HAN-LUN, HUANG HIENG-HSIUNG, WANG WENUN, TENG CHIH-JUNG
Format Patent
LanguageEnglish
Published 27.01.2016
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:A method of fabricating cover plate including the following steps is provided. A plurality of concaves is formed on a mother substrate. A first strengthening treatment is performed on the concave surfaces of the concaves to form an ion strengthened layer thereon. The mother substrate is cut into a plurality of unit substrates corresponding unit area. Each concave is located within one of the unit substrates. A firs concentration of a strengthening ion in the ion strengthened layer is greater than a second concentration of the strengthening ion of the sidewall of each unit substrate.
Bibliography:Application Number: CN20141329521