Low dielectric composite material and laminated plate and circuit board thereof

• Main Authors: CHEN HAO, LI CHANGYUAN, XIE ZHENYU, LI XIANGNAN, CAI LIANHUI
• Format: Patent
• Language: English
• Published: 13.01.2016
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; GLASS; INKS; JOINING GLASS TO GLASS OR OTHER MATERIALS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MINERAL OR SLAG WOOL; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

The present invention belongs to the technical field of resin composite materials, and particularly relates to a low dielectric composite material and a laminated plate and a circuit board prepared based on the low dielectric composite material . The composite material is obtained by adhering a low-dielectric resin composition of a phosphorus-containing flame retardant onto a substrate; The composition comprises the following components: (A) a phosphorus-containing flame retardant; and (B) a vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I). FORMULA as shown in the specification. Through derivation of diphenylphosphine oxide, the phosphorus-containing flame prepared has no functional group and has a better dielectric property, and a high melting point; a resin composition obtained by matching the phosphorus-containing flame with the vinyl compound is used for preparing the composite material with a low thermal expansion rate, high thermal resistance, a high glass transition temperature and a low dielectric constant and dielectric loss, and can produce a laminated plate and a circuit board with properties of a high glass transition temperature, a low dielectric property, halogen-free flame retardancy, a low substrate thermal expansion coefficient and the like.