LED package-free structure and package-free method thereof

The invention provides an LED package-free structure and a package-free method thereof. Grooves corresponding to the position of an LED chip are arranged on a substrate, electrodes of the LED chip are accommodated in the grooves, a circuit of a circuit layer on the substrate is accessed through sold...

Full description

Saved in:
Bibliographic Details
Main Authors ZHOU ZHONGWEI, MENG CHANGJUN
Format Patent
LanguageEnglish
Published 23.12.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The invention provides an LED package-free structure and a package-free method thereof. Grooves corresponding to the position of an LED chip are arranged on a substrate, electrodes of the LED chip are accommodated in the grooves, a circuit of a circuit layer on the substrate is accessed through soldering tin in the grooves, and connection with the electrodes is established through groove structures, such that the problem of heat accumulation of tin beads in a conventional package-free structure is solved, and the reliability of an LED is greatly improved. Besides, an ultraviolet light conversion layer is also utilized for converting ultraviolet light in the LED chip into blue light so that the defect of acceleration of aging of fluorescent powder in a fluorescent powder layer is overcome.
Bibliography:Application Number: CN20151499087