Wafer-level packaging method of back-illuminated image sensor and packaging structure

• Main Authors: JING XIANGMENG, FENG GUANGJIAN
• Format: Patent
• Language: English
• Published: 23.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates to a wafer-level packaging method of a back-illuminated image sensor and a packaging structure. The method comprises a step of bonding a load wafer at the front side of a CIS wafer, thinning the CIS wafer with the load wafer as a support, and adding a light filter and a micro lens at the back side of the CIS wafer, a step of covering the back side of the CIS wafer by using translucent plastic and protecting the light filter and the micro lens through the translucent plastic, a step of supporting the wafer with the translucent plastic as a support, a step of making a lead at the back side of the load wafer, a step of thinning the translucent plastic and cutting the translucent plastic to obtain a single chip, and ending the packaging method. According to the wafer-level packaging method, a layer of translucent plastic is directly used to cover a light sensing area to be a protection cover, the protection cover is used as a support to make a following lead process, the translucent plastic is polished through grinding and polishing, and finally the wafer is cut to be the single chip. According to the wafer-level packaging method and the packaging structure, the process difficulty and cost are reduced, and the thickness of the chip is reduced at the same time.