玻璃基板的切断方法及玻璃基板的制造方法

• Format: Patent
• Language: Chinese
• Published: 12.06.2018
• Subjects: CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GLASS; MACHINE TOOLS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MINERAL OR SLAG WOOL; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; TRANSPORTING; WELDING; WORKING BY LASER BEAM

提供种玻璃基板的切断方法，照射激光而将玻璃基板沿着切断预定线进行切断，其特征在于，使包含向玻璃基板的方的表面照射激光的激光的照射区域的、玻璃基板的与切断预定线正交的宽度方向的部分的区域在玻璃基板的宽度方向上弯曲，在激光的照射区域中，从玻璃基板的方的表面到另方的表面为止的激光照射部加热至气化的温度以上，使激光的照射区域沿着玻璃基板的切断预定线相对于玻璃基板相对地移动。 Provided is a glass substrate cutting method for cutting a glass substrate along a scheduled cut line by irradiating the glass substrate with laser light, the glass substrate cutting method being characterized by: curving a partial region in the width direction orthogonal to the scheduled cut line of the glass substrate including a laser light irradiation region to be irradiated with the laser light in one surface of the glass substrate, in the width direction of the glass substrate; heating the glass substrate in the laser light irradiation region to or above a temperature at which a laser light irradiated portion from one surface to the other surface of the glass substrate is vaporized; and moving the laser light irradiation region relatively to the glass substrate along the scheduled cut line of the glass substrate.