Laminated resin structure, dry film, and flexible printed wire board

Provided is a laminated resin structure capable of achieving a protective film which is superior in insulation properties and light barrier properties. The present invention is a laminated resin structure (1) having an adhesion layer (A), and a protective layer (B) stacked upon a flexible base mater...

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Bibliographic Details
Main Authors KOIKE NAOYUKI, HAYASHI MAKOTO, YOKOYAMA YUTAKA, MIYABE HIDEKAZU
Format Patent
LanguageEnglish
Published 09.12.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:Provided is a laminated resin structure capable of achieving a protective film which is superior in insulation properties and light barrier properties. The present invention is a laminated resin structure (1) having an adhesion layer (A), and a protective layer (B) stacked upon a flexible base material (2) across the adhesion layer (A), wherein the adhesion layer (A) contains a colorant other than carbon black. On a flexible printed wire board, the laminated resin structure (1) is cured upon the flexible printed wire board so as to serve as a protective film.
Bibliography:Application Number: CN2014822938