Solder ball and manufacturing method therefor, and ball grid array package comprising solder ball

• Main Author: WANG YUCHUAN
• Format: Patent
• Language: English
• Published: 09.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a solder ball and a manufacturing method therefor, and a ball grid array package comprising the solder ball. According to the invention, the solder ball comprises a body and a concave-convex structure; a chip is connected with a printed circuit board through the body; the concave-convex structure is positioned in the surface of the body, wherein the surface of the body is to be connected with the printed circuit board. According to the solder ball, the solder ball with the concave-convex structure can dramatically enlarge the contact area between the solder ball and soldering flux to facilitate welding and prevent from generating cold solder joints; and in addition, since that the contact area between the solder ball and the soldering flux is enlarged through the concave-convex structure, the impregnating height of the solder ball in the soldering flux is not needed to be increased, so that unexpected connections among a plurality of solder balls caused by narrowed distances among the solder balls can be prevented.