Pouring sealant and preparation method for same

The invention relates to a pouring sealant and a preparation method for the same. The pouring sealant consists of the following raw materials in percentage by weight: 30 to 60 percent of epoxy resin, 2 to 10 percent of a diluent, 0.5 to 5 percent of a silane coupling agent, 0.5 to 22 percent of a cu...

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Bibliographic Details
Main Authors WANG HONGJUAN, XIE HAIHUA, WANG JIANBIN, CHEN TIANAN
Format Patent
LanguageEnglish
Published 09.12.2015
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The invention relates to a pouring sealant and a preparation method for the same. The pouring sealant consists of the following raw materials in percentage by weight: 30 to 60 percent of epoxy resin, 2 to 10 percent of a diluent, 0.5 to 5 percent of a silane coupling agent, 0.5 to 22 percent of a curing agent, 15 to 45 percent of compound silica micropowder and 0.5 percent of carbon black. The pouring sealant is high in flowing speed, antifoaming performance and adhesion and low in gap permeability, and is particularly applicable to the pouring of a complexly-structured component with a gap below which a circuit board is arranged, and the poured component is smooth in appearance and high in reliability.
Bibliography:Application Number: CN20151582657