High-temperature-resistant resin

• Main Authors: XI JIANJUN, HOU MEI, QIAO YONGMEI, XIE RUIGUANG
• Format: Patent
• Language: English
• Published: 09.12.2015
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The invention discloses high-temperature-resistant resin. The high-temperature-resistant resin is prepared from, by weight, 100 parts of epoxy resin, 99-115 parts of curing agents and 1-5 parts of promoters; trifunctional epoxy resin and/or tetrafunctional epoxy resin or a mixture of one or several of the trifunctional epoxy resin and tetrafunctional epoxy resin and bifunctional epoxy resin are/is adopted as the epoxy resin; amine curing agents or anhydride curing agents are adopted as the curing agents, wherein the amine curing agents are prepared by mixing, by mass, 15-20 parts of curing agents DDM, 10-15 parts of curing agents DDS and 65-90 parts of curing agents DADMT, and methyl tetrahydrophthalic anhydride or methylhexahydrophthalic anhydride or methyl nadic anhydride is adopted as the anhydride curing agents; dimethyl benzylamine or imidazole is adopted as the promoters. The high-temperature-resistant resin has the good high temperature resisting property, mechanical property and technological property and is suitable for winding technology for glass fibers and carbon fibers.