Product processing technology employing laser copper baking

• Main Authors: WEN GUOHAO, DENG YUEZHONG, ZHANG ZIYUE
• Format: Patent
• Language: English
• Published: 02.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention discloses a product processing technology employing laser copper baking, and the technology comprises the following steps: (1) etching: etching the front surface of a target copper plate; (2) carrying out the die bonding, wiring and molding of the copper plate finished at step (1); (3) copper baking: carrying out the copper baking of the product after molding, and enabling an end electrode to expose copper; (4) copper cutting: cutting the product after copper baking, and completing the machining of the product. The technology employs a laser copper-baking dry-type etching technology at step (3). The copper baking process after molding is completed in a mode of lase etching. The technology improves copper-baking precision, reduces product errors, cannot generate waste water, and is shorter in manufacturing time.