Laser processing method and laser processing apparatus

• Main Authors: UCHIYAMA NAOKI, WAKUDA TOSHIMITSU, FUKUYO FUMITSUGU, FUKUMITSU KENSHI
• Format: Patent
• Language: English
• Published: 02.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; MACHINE TOOLS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MINERAL OR SLAG WOOL; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PERFORMING OPERATIONS; PHYSICS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam (L) is radiated on the predetermined cut line (5) on the surface (3) of the work (1) under the conditions causing a multiple photon absorption and with a condensed point (P) aligned to the inside of the work (1), and a modified area is formed inside the work (1) along the predetermined determined cut line (5) by moving the condensed point (P) along the predetermined cut line (5), whereby the work (1) can be cut with a rather small force by cracking the work (1) along the predetermined cut line (5) starting from the modified area and, because the pulse laser beam (L) radiated is not almost absorbed onto the surface (3) of the work (1), the surface (3) is not fused even if the modified area is formed.