Curable composition
The present application relates to a curable composition and a use thereof. The curable composition of the present application can provide a cured material, which has excellent processability and workability, which does not allow occurrence of white turbidity and stickiness on a surface thereof, and...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
25.11.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The present application relates to a curable composition and a use thereof. The curable composition of the present application can provide a cured material, which has excellent processability and workability, which does not allow occurrence of white turbidity and stickiness on a surface thereof, and which has excellent adhesive property. The curable composition has excellent heat-resistance, gas barrier property, and crack-resistance. Therefore, for example, a semiconductor device, to which the composition is applied, can maintain stable performance even when the semiconductor device is used for a long time at a high temperature. |
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Bibliography: | Application Number: CN201480019833 |