Chip encapsulating structure

• Main Author: CHEN CHONGLONG
• Format: Patent
• Language: English
• Published: 25.11.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a chip encapsulating structure which includes a support plate, a flexible circuit board and at least one chip. The support plate includes an upper surface and a lower surface relative to the upper surface. The flexible circuit board has a first surface, a second surface relative to the first surface, and multiple pins. The pins are arranged on the first surface so as to partition the flexible circuit board to a circuit region and a circuit-free region. The flexible circuit board enables, through the bending of the circuit-free region, enables the second surface to be independently adhesive to the upper surface and the lower surface, wherein the upper surface corresponds to the circuit region and the lower surface corresponds to the lower surface. The flexible circuit board has a thickness of T1, and the circuit-free region has a minimum thickness of T2 at the bending position, wherein the minimum thickness T2 is smaller than the thickness T1. The chip is arranged on circuit region and is electrically connected to the pins.